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GD5F1GQ4REFJS Folha de dados(PDF) 54 Page - GigaDevice Semiconductor (Beijing) Inc.

Nome de Peças GD5F1GQ4REFJS
Descrição Electrónicos  SPI(x1/x2/x4) NAND Flash
PDF  60 Pages
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Fabricante Electrônico  GIGADEVICE [GigaDevice Semiconductor (Beijing) Inc.]
Página de início  http://www.gigadevice.com/
Logo GIGADEVICE - GigaDevice Semiconductor (Beijing) Inc.

GD5F1GQ4REFJS Folha de dados(HTML) 54 Page - GigaDevice Semiconductor (Beijing) Inc.

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SPI(x1/x2/x4) NAND Flash
1G
54
21 PACKAGE INFORMATION
Figure21-1. WSON8 (6*8mm)
D
E
Top View
D2
E2
L
b
e
Bottom View
c
A1
A
Side View
Dimensions
Symbol
A
A1
c
b
D
D2
E
E2
e
L
Unit
mm
Min
0.70
0.00
0.180
0.35
7.90
3.30
5.90
4.20
1.27
0.45
Nom
0.75
0.02
0.203
0.40
8.00
3.40
6.00
4.30
0.50
Max
0.80
0.05
0.250
0.45
8.10
3.50
6.05
4.40
0.55
Inch
Min
0.028
0
0.007
0.014
0.311
0.130
0.232
0.165
0.05
0.018
Nom
0.030
0.001
0.008
0.016
0.315
0.134
0.236
0.169
0.020
Max
0.032
0.002
0.010
0.018
0.319
0.138
0.238
0.173
0.022
Note:
1. Both the package length and width do not include the mold flash.
2. The exposed metal pad area on the bottom of the package is floating.
3. Coplanarity ≤0.08mm. Package edge tolerance≤0.10mm.
4. The lead shape may be of little difference according to different package lead frames. These lead
shapes are compatible with each other.



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