W-GM-5200 datasheet(2/2 Pages) ACCRETECH

2 / 2 page

C-97-89-E-1811

Basic Specification

Wafer size

Φ300 mm

Wafer thickness

0.6 - 1.0 mm

Wafer shape

Φ300 mm (with notch)

Peipheral Grinding

Outer diameter (groove)

Φ200 mm

Outer diameter (periphery)

Φ202 mm

Inner diameter

φ30 mm

Flange thickness

20 mm

Periphera l velocity

5000 m / min

(maximum)

Spindle bearing system

Grease lubrication,mechanical bearing system

Spindle driving system

Built-in system

Grinding speed

Any setting possible

Notch grinding

Outer diameter (groove)

Φ1.8-2.4 mm

Outer diameter (periphery)

Φ3.8 mm

shank diameter

Φ3 mm

Revolution speed

80000 min-1

Spindle bearing system

Air bearing system

Spindle driving system

Air turbine system

Grinding speed

0.1-1.0 mm / sec

Signal tower

3-color indicator (the color and flashing / lighting

can be changed by key input)

Option

Low Damage Grinding System

Periphery Fine

spindle frequency

Rated

：36000 min-1

Max

：70000 min-1 (motor)

Spindle bearing system

Air bearing system

Spindle driving system

High Frequency Built-in System

Notch Fine spindle frequency

150000 min-1

Spindle bearing system

Air bearing system

Spindle driving system

High Frequency Built-in System

Wheel profile (Periphery fine)

Groove Diameter

Φ46.6-42 mm

Outer Diameter

Φ50 mm

Flange Thickness

15 mm

Wheel profile (Notch fine)

Groove Diameter

Φ1.8 - 2.2 mm

Outer Diameter

Φ3.8

Shank Diameter

Φ3 mm

Mechanical specifications

Wafer thickness measurement

Resolution

1 μm

Repeated measurement

accuracy

Within ±2 μm

Measuring system

Non-contact system

Alignment mechanism

System

Laser measuring system

Resolution

1μm

Centering accuracy

Within ±50 μm

Grinding table linear axis (X / Y / Z )

Resolution

1μm

Driving system

AC servomotor and ball screw

Grinding table revolution axis (

θ)

Resolution

0.001°

Driving system

DD motor and higt resolution mechanism

Grinding table flatness

Surface fluctuation

Less than 10 μm

/ 360°

Transfer unit

Conveying system

Suction conveying system

Vacuum generating source

Vacuum ejector

Wafer identifying sensor

Vacuum sensor

Cleaning unit

Cleaning system

Spinner cleaning

Drying system

Dry air system

Driving system

AC servomotor

Revolution speed

500-1500 min-1

Loading and unloading unit

Type

Cassette carrier type (with options)

Other specifications

Dimensions,Weight

W-GM-5200-3C

2515 (W) x 1475 (D) x 2000 (H) / *2300mm

5000kg *including the signal tower

W-GM-5200-8C

3040 (W) x 1775 (D) x 2000 (H) / *2300mm

5000kg *including the signal tower

W-GM-5200 Specification

TOSEI AMERICA, Inc.

ACCRETECH-TOSEI Hungary Kft.

TOSEI ENGINEERING PRIVATE LIMITED.

TOSEI(Thailand)Co., Ltd.

TOSEI ENGINEERING MALAYSIA SDN. BHD.

PT TOSEI INDONESIA

TOSEI KOREA CO.,LTD.

TOSEI MEASURING(PINGHU)CORP

TOSEI ENGINEERING CORP.

TOSEI TAIWAN CO., LTD.

TOSEI MEXICO, S.A. de C.V.

TOSEI PHILIPPINES CORP.

OVERSEAS NETWORK

　Tsuchiura Factory Edge Division

　2-14 Kita-kandatsu,Tsuchiura-city Ibaraki 300-0015, Japan

TEL 029-830-1882

E-mail gijyutsu1@toseieng.co.jp

Contact Information

http://www.toseieng.co.jp/wafer/en/

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