INMP504

OUTLINE DIMENSIONS

Figure 10. 3-Terminal Chip Array Small Outline No-Lead Cavity [LGA_CAV]

3.35 × 2.50 × 0.88 mm Body

Dimensions shown in millimeters

Figure 11. Package Marking Specification (Top View)

ORDERING GUIDE

PART

TEMP RANGE

PACKAGE

QUANTITY

−40°C to +85°C 3-Terminal

LGA_CAV

10,000

−40°C to +85°C 3-Terminal

LGA_CAV

1,000

EV_INMP504-FX

—

Flex Evaluation

Board

—

* – 13” Tape and Reel

† – 7” Tape and Reel to be discontinued. Check with sales@invensense.com for availability.

REVISION HISTORY

REVISION DATE

REVISION

DESCRIPTION

02/06/2014

1.0

Initial Release

2.575

2.500

2.425

3.425

3.350

3.275

TOP VIEW

SIDE VIEW

REFERENCE

CORNER

0.98

0.88

0.78

0.21 REF

2.21

REF

3.06 REF

0.65 REF

BOTTOM VIEW

1.08

0.95 DIA.

0.25 NOM

0.20 MIN

DIA.

THRU HOLE

(SOUND PORT)

1.22 BSC

1.25

0.54

REF

0.64 REF

1.56 DIA.

1.52

0.75 REF

1

3

2

0.90 × 0.68

(PINS 1, 3)

0.20 TYP

× 45°

0.30 BSC

PIN 1

YY XXX

504

LOT TRACEABILITY CODE

PIN 1 INDICATION

PART NUMBER

DATECODE

Page 12 of 13

Document Number: DS-ADMP504-00

Revision: 1.0.