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RF64W Folha de dados(PDF) 75 Page - HOPE Microelectronics CO., Ltd.

Nome de Peças RF64W
Descrição Electrónicos  Ultra-Low Power Integrated 300-510MHz Transceiver
PDF  76 Pages
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Fabricante Electrônico  HOPE [HOPE Microelectronics CO., Ltd.]
Página de início  https://www.hoperf.com/
Logo HOPE - HOPE Microelectronics CO., Ltd.

RF64W Folha de dados(HTML) 75 Page - HOPE Microelectronics CO., Ltd.

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ADVANCED COMMUNICATIONS & SENSING
Page 75 of 76
RF64
Tel: +86-755-82973805 Fax: +86-755-82973550 E-mail: sales@hoperf.com http://www.hoperf.com
D
B
E
bbb
C A B
8. Packaging Information
8.1. Package Outline Drawing
RF64 is available in a 32-lead TQFN package as shown in Figure 59 below.
A
DIMENSIONS
INCHES
MILLIMETERS
DIM
MIN NOM MAX MIN NOM MAX
A
.028
-
.031 0.70
-
0.80
A1 .000
-
.002 0.00
-
0.05
A2
-
(.008)
-
-
(0.20)
-
PIN 1
b
.007 .010 .012 0.18 0.25 0.30
INDICATOR
(LASER MARK)
D
.193 .197 .201 4.90 5.00 5.10
D1 .142 .146 .150 3.60 3.70 3.80
E
.193 .197 .201 4.90 5.00 5.10
E1 .142 .146 .150 3.60 3.70 3.80
e
.020 BSC
0.50 BSC
L
.012 .016 .020 0.30 0.40 0.50
aaa C
A
A1
A2
SEATING
PLANE
C
N
aaa
bbb
32
.003
.004
32
0.08
0.10
D1
LxN
E/2
E1
NOTES:
2
1
e/2
N
e
D/2
bxN
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Figure 59: Package Outline Drawing
8.2. PCB Land Pattern
K
DIMENSIONS
H
(C)
DIM
C
Z
G
G
H
K
P
X
Y
Y
Z
INCHES
(.197)
.165
.146
.146
.020
.012
.031
.228
MILLIMETERS
(5.00)
4.20
3.70
3.70
0.50
0.30
0.80
5.80
X
P
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD
SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.
FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR
FUNCTIONAL PERFORMANCE OF THE DEVICE.
4. SQUARE PACKAGE - DIMENSIONS APPLY IN BOTH " X " AND " Y " DIRECTIONS.
Figure 60: PCB Land Pattern



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