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KBE00F005A Folha de dados(PDF) 2 Page - Samsung semiconductor |
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KBE00F005A Folha de dados(HTML) 2 Page - Samsung semiconductor |
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2 / 87 page ![]() June 2005 2 KBE00F005A-D411 MCP MEMORY Revision 1.0 Document Title Multi-Chip Package MEMORY 512M Bit(64Mx8) Nand Flash*2 / 256M Bit (2Mx32x4Banks) Mobile SDRAM*2 Revision History The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have any questions, please contact the SAMSUNG branch office near you. Revision No. 0.0 1.0 Remark Preliminary Final History Initial issue. - 1Gb NAND Flash DDP B-Die _ Ver 0.1 - 512Mb Mobile SDRAM DDP F-Die _ Ver 1.0 <Common> - Changed operating temperature : page 3 <NAND Flash> .... Ver 0.2 - Changed flow chart : page 16 - Finalize Draft Date April 06, 2005 June 21, 2005 Note : For more detailed features and specifications including FAQ, please refer to Samsung’s web site. http://samsungelectronics.com/semiconductors/products/products_index.html |
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