DFM2800 datasheet(2/2 Pages) DISCO

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Fully Automatic Multifunction Wafer Mounter

DFM2800

DFM2800 Operation flow

[1] Workpiece reception from the grinder

[2] UV irradiation to the front side protection tape on the workpiece

(when the UV tape is used)

[3] Workpiece transfer to the inspection table (when inspection is

needed)

[4] Alignment using image processing

[5] Workpiece mounting with dicing tape or 2 in 1 DAF tape

[6] Front side protection tape peeling from the workpiece

[7] Tape frame storage (with mounted workpiece) in the

cassette

Specifications

Environmental conditions

• Use clean, oil-free air at a dew point of -15 ℃ or less. (Use a residual oil: 0.1 ppm. Filtration rating: 0.01 μm/99.5 % or more).

• Keep room temperature fluctuations within ±1 ℃ of the set value. (Set value should be between 20 - 25 ℃).

• The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening,

heat generation equipment or oil mist generating parts.

* All pressures specified above are gauge pressures.

* As the above specification may change due to technical modifications. Please confirm when placing your order.

* For further information, please contact your local sales representative.

2014.11

Unit

200/φ300

±0.5 or less

deg

±0.5 or less

±1.0 or less

2,150×2,643×1,800

Approx.3,100

Machine weight

Machine dimensions(W×D×H)

Wafer attachment precision and

θ direction (frame mount)

Dicing tape attachment precision and

X/Y direction

Specification

Wafer Diameter

Wafer attachment precision and

X/Y direction (frame mount)

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