Philips Semiconductors

PIP401

OR-ing Intelligent Switch

Product data

Rev. 03 — 5 November 2002

7 of 16

9397 750 10578

© Koninklijke Philips Electronics N.V. 2002. All rights reserved.

9.

Thermal characteristics

9.1 Transient thermal impedance

Table 4:

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from

junction to mounting base

Figure 4

-

0.5

0.65

K/W

thermal resistance from

junction to ambient

mounted on glass-epoxy

circuit board with 25 mm x

25 mm copper area under

mounting base, thermal vias

and forced air cooling;

(150 LFM).

-

15

-

K/W

mounted on glass-epoxy

circuit board with minimum

footprint area

-

50

-

K/W

Fig 4.

Transient thermal impedance from junction to mounting base as a function of pulse duration.

03af37

10-3

10-2

10-1

1

10-6

10-5

10-4

10-3

10-2

10-1

1

10

tp (s)

Zth(j-mb)

(K/W)

single pulse

δ = 0.5

0.2

0.1

0.05

0.02

tp

tp

T

P

t

T

δ =