Data Sheet

HMC856

Rev. D | Page 5 of 13

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

17

1

3

4

2

GND

PACKAGE

BASE

I+

I–

GND

5

6

GND

B0+

7

B0–

8

NC

NC

18 B4–

19 B4+

20 GND

21 GND

22 O–

23 O+

24 GND

HMC856

TOP VIEW

(Not to Scale)

NOTES

1. NC = NO CONNECT.

2. NIC = NOT INTERNALLY CONNECTED.

3. EXPOSED PAD. THE EXPOSED PAD MUST

BE CONNECTED TO THE NEGATIVE

VOLTAGE SUPPLY.

Figure 3. Pin Configuration

Table 3. Pin Function Descriptions

Pin Number

Mnemonic

Description

1, 4, 5, 11, 14, 20, 21, 24

GND

Signal Ground.

2, 3

I+, I−

Differential Data Inputs. CML referenced to positive supply.

6, 7, 9, 10, 12, 13, 15, 16,

18, 19

B0+, B0−, B1+, B1−, B2+, B2−,

B3+, B3−, B4−, B4+

Differential Digital Control Inputs. CML referenced to positive supply.

8, 17

NC

No Connect. These pins are internally connected to the device. These pins can

be connected to radio frequency (RF)/dc ground without affecting performance.

25, 32

NIC

Not Internally Connected. These pins can be connected to radio frequency

(RF)/dc ground without affecting performance.

22, 23

O−, O+

Differential Data Outputs. CML referenced to positive supply, 50 Ω termination.

26, 31

GND

Supply Ground.

27, 30

Negative Supply Voltage. These pins and the exposed pad must be connected

to the negative voltage supply.

28

VR

Output Level Control. Output levels can be increased or decreased by

applying voltage to VR, as shown in Figure 12.

29

VB

DC Bias Voltage. VB must be connected to ground.

Exposed Pad. The exposed pad must be connected to the negative voltage supply.