6

FH41 Series

BRecommended Soldering Profile

Application conditions

Reflow type : Reflow with far-infrared ray and hot air combined

Reflow furnace atmosphere: Air

Solder

: Cream type Sn/3.0 Ag/0.5 Cu

(Senju Metal Industry, M705-221CM5-42-10.5)

Test board : Board material and size

Glass epoxy 30∞60∞0.8mm

Land dimension 0.3∞0.65, 0.3∞1.2mm

Metal mask : Thickness 0.1mm

Opening dimensions 0.25∞0.65, 0.2∞1mm

This temperature profile shall be used under the above

application conditions.

This temperature profile is based on the conditions provided

above.

Please check the mounting conditions before use, conditions

such as solder paste types, manufacturer, PCB size and any

other soldering materials may alter the performance of such

materials.

BFH41 Series FFC materials configuration

(recommended specifications)