4

ULN2002A, ULN2003A, ULN2003AI

ULQ2003A, ULN2004A, ULQ2004A

SLRS027O – DECEMBER 1976 – REVISED JANUARY 2016

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Product Folder Links: ULN2002A ULN2003A ULN2003AI ULQ2003A ULN2004A ULQ2004A

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Copyright © 1976–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to the emitter/substrate terminal E, unless otherwise noted.

6 Specifications

6.1 Absolute Maximum Ratings

at 25°C free-air temperature (unless otherwise noted)

(1)

MIN

MAX

UNIT

Collector-emitter voltage

50

V

50

V

30

V

Peak collector current, See Figure 4 and Figure 5

500

mA

Output clamp current

500

mA

Total emitter-terminal current

–2.5

A

Operating free-air temperature range

ULN200xA

–20

70

°C

ULN200xAI

–40

105

ULQ200xA

–40

85

ULQ200xAT

–40

105

Operating virtual junction temperature

150

°C

Lead temperature for 1.6 mm (1/16 inch) from case for 10 seconds

260

°C

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

±2000

V

±500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Collector-emitter voltage (non-V devices)

0

50

V

Junction temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

ULx200x

UNIT

D

(SOIC)

N

(PDIP)

NS

(SO)

PW

(TSSOP)

16 PINS

16 PINS

16 PINS

16 PINS

Junction-to-ambient thermal resistance

73

67

64

108

°C/W

Junction-to-case (top) thermal resistance

36

54

n/a

33.6

°C/W

Junction-to-board thermal resistance

n/a

n/a

n/a

51.9

°C/W

Junction-to-top characterization parameter

n/a

n/a

n/a

2.1

°C/W

Junction-to-board characterization parameter

n/a

n/a

n/a

51.4

°C/W