IP4309CX9

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© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 1 — 10 March 2011

9 of 14

NXP Semiconductors

IP4309CX9

HDMI octal channel low capacitive high-performance ESD protection

[1]

Cumulated pitch error:

0.2 mm per 10 pitches.

[2]

Carbon-loaded polystyrene 100 % recyclable.

[3]

The cover tape shall not overlap the sprocket holes.

10. Design and assembly recommendations

10.1 PCB design guidelines

It is recommended, for optimum performance, to use a Non-Solder Mask

Defined (NSMD), also known as a copper-defined design, incorporating laser-drilled

micro-vias connecting the ground pads to a buried ground-plane layer. This results in the

lowest possible ground inductance and provides the best high frequency and

ESD performance. Refer to Table 7 for the recommended PCB design parameters.

10.2 PCB assembly guidelines for Pb-free soldering

Device

rotation



20



max

Carrier tape antistatic[2]

film thickness

T

0.25

0.07

Cover tape[3]

width

5.75

max

film thickness

0.1

max

Bending radius

in winding direction

R

30

min

Table 6.

Description

Item

Symbol

Specification (mm)

Dimension

Tolerance

Table 7.

Recommended PCB design parameters

Parameter

Value or specification

PCB pad diameter

250

m

Micro-via diameter

100

m (0.004 inch)

Solder mask aperture diameter

325

m

Copper thickness

20

m to 40 m

Copper finish

AuNi

PCB material

FR4

Table 8.

Assembly recommendations

Parameter

Value or specification

Solder screen aperture diameter

325

m

Solder screen thickness

100

m (0.004 inch)

Solder paste: Pb-free

SnAg (3 % to 4 %); Cu (0.5 % to 0.9 %)

Solder to flux ratio

50 : 50

Solder reflow profile

see Figure 9