Philips Semiconductors

TFA9841J

1-channel audio amplifier (1 x SE)

Preliminary data

Rev. 01 — 06 February 2004

13 of 17

9397 750 12014

© Koninklijke Philips Electronics N.V. 2004. All rights reserved.

15. Package outline

Fig 14. DBS9P package outline.

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

2. Plastic surface within circle area D1 may protrude 0.04 mm maximum.

SOT523-1

0

10 mm

5

scale

bp

Dh

q1

Z

19

e

e1

m

e2

x

A2

non-concave

D1

D

P

k

q2

L3

L2

L

Qc

E

00-07-03

03-03-12

DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad

SOT523-1

view B: mounting base side

B

UNIT

bp

L1

Dh

Lq2

mm

2.7

2.3

A2

(2)

0.80

0.65

0.58

0.48

13.2

12.8

D1

(2)

6.2

5.8

3.5

Eh

3.5

e

2.54

e1

1.27

e2

5.08

4.85

Q

14.7

14.3

1.65

1.10

11.4

10.0

L2

6.7

5.5

L3

4.5

3.7

3.4

3.1

1.15

0.85

q

17.5

16.3

q1

2.8

m

0.8

v

3.8

3.6

3

2

12.4

11.0

P

k

0.02

x

0.3

w

Eh

L1

q