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REF3425 Folha de dados(PDF) 18 Page - Texas Instruments

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Nome de Peças REF3425
Descrição Electrónicos  Low-Drift, Low-Power, Small-Footprint Series Voltage References
PDF  28 Pages
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Fabricante Electrônico  TI1 [Texas Instruments]
Página de início  http://www.ti.com
Logo TI1 - Texas Instruments

REF3425 Folha de dados(HTML) 18 Page - Texas Instruments

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REF3425-Q1, REF3430-Q1, REF3433-Q1, REF3440-Q1, REF3450-Q1
SBAS901 – JULY 2018
www.ti.com
Product Folder Links: REF3425-Q1 REF3430-Q1 REF3433-Q1 REF3440-Q1 REF3450-Q1
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Copyright © 2018, Texas Instruments Incorporated
Typical Applications (continued)
10.2.1.1 Design Requirements
A detailed design procedure is based on a design example. For this design example, use the parameters listed in
Table 2 as the input parameters.
Table 2. Design Example Parameters
DESIGN PARAMETER
VALUE
Input voltage VIN
7 V
Output voltage VOUT
5 V
REF3450-Q1 input capacitor
1 µF
REF3450-Q1 output capacitor
10 µF
10.2.1.2 Detailed Design Procedure
10.2.1.2.1
Input and Output Capacitors
A 1-μF to 10-μF electrolytic or ceramic capacitor can be connected to the input to improve transient response in
applications where the supply voltage may fluctuate. Connect an additional 0.1-μF ceramic capacitor in parallel to
reduce high frequency supply noise.
A ceramic capacitor of at least a 0.1 μF must be connected to the output to improve stability and help filter out
high frequency noise. An additional 1-μF to 10-μF electrolytic or ceramic capacitor can be added in parallel to
improve transient performance in response to sudden changes in load current; however, keep in mind that doing
so increases the turnon time of the device.
Best performance and stability is attained with low-ESR, low-inductance ceramic chip-type output capacitors
(X5R, X7R, or similar). If using an electrolytic capacitor on the output, place a 0.1-μF ceramic capacitor in parallel
to reduce overall ESR on the output.
10.2.1.2.2
4-Wire Kelvin Connections
Current flowing through a PCB trace produces an IR voltage drop, and with longer traces, this drop can reach
several millivolts or more, introducing a considerable error into the output voltage of the reference. A 1-inch long,
5-millimeter wide trace of 1-ounce copper has a resistance of approximately 100 mΩ at room temperature; at a
load current of 10 mA, this can introduce a full millivolt of error. In an ideal board layout, the reference must be
mounted as close as possible to the load to minimize the length of the output traces, and, therefore, the error
introduced by voltage drop. However, in applications where this is not possible or convenient, force and sense
connections (sometimes referred to as Kelvin sensing connections) are provided as a means of minimizing the IR
drop and improving accuracy.
Kelvin connections work by providing a set of high impedance voltage-sensing lines to the output and ground
nodes. Because very little current flows through these connections, the IR drop across their traces is negligible,
and the output and ground
It is always advantageous to use Kelvin connections whenever possible. However, in applications where the IR
drop is negligible or an extra set of traces cannot be routed to the load, the force and sense pins for both VOUT
and GND can simply be tied together, and the device can be used in the same fashion as a normal 3-terminal
reference (as shown in Figure 26).
10.2.1.2.3
VIN Slew Rate Considerations
In applications with slow-rising input voltage signals, the reference exhibits overshoot or other transient
anomalies that appear on the output. These phenomena also appear during shutdown as the internal circuitry
loses power.
To avoid such conditions, ensure that the input voltage wave-form has both a rising and falling slew rate close to
6 V/ms.



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