Specificationsaresubjecttochangewithoutnotice.

Usersshouldverifyactualdeviceperformanceintheirspecificapplications.

Recommended Pad Layout

Dark grey areas show added PCB copper area for better

thermal resistance.

finish. For improved thermal dissipation, the recommended layout

uses PCB copper areas which extend beyond the exposed solder

pad. The exposed solder pads should be defined by a solder mask

ing. It is recommended that they should be the same dimension as

0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length.

to ensure adequate clearance is maintained. The recommended

stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil

opening size 0.025 mm (0.0010 in.) less than the solder pad size.

Extended copper areas beyond the solder pad significantly improve

the junction to ambient thermal resistance, resulting in operation

at lower junction temperatures with a corresponding benefit of reli-

ability. All pads should soldered to the PCB, including pads marked

as NC or NU but no electrical connection should be made to these

pads. Care should be taken to assure no resistive path exists

between the NU pins to any other point to avoid unexpected

performance issues. For minimum parasitic capacitance, it is

recommended that signal, ground or power signals are not routed

beneath any pad.

4

5

6

3

2

1

Reflow Profile

32

1

3.55

(.140)

0.70

(.028)

1.15

(.045)

2.625

(.103)

PIN 1

TOP VIEW

SIDE VIEW

BOTTOM VIEW

A

D

BE

C

JJ

N

N

H

E

K

K

F

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (Tsmax to Tp)

3 °C/sec. max.

Preheat

- Temperature Min. (Tsmin)

- Temperature Max. (Tsmax)

- Time (tsmin to tsmax)

150 °C

200 °C

60-180 sec.

Time maintained above:

- Temperature (TL)

- Time (tL)

217 °C

60-150 sec.

Peak/Classification Temperature (Tp)

260 °C

Time within 5 °C of Actual Peak Temp. (tp)

20-40 sec.

Ramp-Down Rate

6 °C/sec. max.

Time 25 °C to Peak Temperature

8 min. max.

Typical Part Marking

How to Order

TBU - DB 055 - 100 - WH - Q

Series

DB = Dual Bidirectional Series

Impulse Voltage Rating

055 = 550 V

Trigger Current

100 = 100 mA

Hold to Trip Ratio Suffix

W = Hold to Trip Ratio

Package Suffix

H = DFN Package

AEC-Q101 Suffix

Q = AEC-Q101 Compliant

MANUFACTURER’S

TRADEMARK

5 DIGIT PRODUCT CODE:

• 1ST ALPHA CHARACTER INDICATES PRODUCT FAMILY:

B = TBU-DB SERIES

• 2ND & 3RD DIGITS INDICATE IMPULSE VOLTAGE.

• 4TH & 5TH DIGITS INDICATE TRIGGER CURRENT.

UNDERSCORE DENOTES AEC-Q101 COMPLIANCE.

MANUFACTURING

DATE CODE:

• 1ST DIGIT INDICATES THE YEAR.

• 2ND & 3RD DIGITS INDICATE THE WEEK NUMBER.

• 4TH & 5TH DIGITS INDICATE LOT CODE.

PIN 1 INDICATOR

XXXXX

YWWLL