ADA4312-1

Data Sheet

Rev. A | Page 4 of 12

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage, V

CC

13.2 V

SD Voltage

V

CC

Power Dissipation

1.25 W

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

evaluation board (EVAL-ADA4312-1ACPZ).

Table 3.

Package Type

θ

JA

Unit

16-Lead LFCSP

31.8

°C/W

MAXIMUM POWER DISSIPATION

Exceeding a junction temperature of 150°C can result in changes

to silicon devices, potentially causing degradation or loss of

functionality.

The power dissipation of the ADA4312-1 is 750 mW for a typical

G.hn application delivering 16 dBm into a 40 Ω differential load.

The maximum internal power dissipation should not exceed

1.25 W over the extended industrial temperature range of −40°C

to +85°C on a PCB designed according to the guidelines in the

Thermal Management section.

ESD CAUTION