DataSheet

DIN Rail Mount

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ANNEX - ENVIROMENTAL INFORMATION

The environmental information disclosed in this annex including the EIP Pollution logo are in compliance with People’s Republic of China

Electronic Industry Standard SJ/T11364 – 2006, Marking for Control of Pollution Caused by Electronic Information Products.

Part

Name

Toxic or hazardous Substance and Elements

Lead

Mercury

Cadmium

Hexavalent

Polybrominated

Polybrominated

(Pb)

(Hg)

(Cd)

Chromium

(Cr (VI))

biphenyls

(PBB)

diphenyl ethers

(PBDE)

Semiconductor die

Solder

附件 - 环保信息

此附件所标示的包括电子信息产品污染图标的环保信息符合中华人民共和国电子行业标准 SJ/T11364 - 2006,

电子信息产品污染控制标识要求。

有毒有害物质或元素

件

部

名称

铅

汞

镉

六价铬

多溴联苯

多溴二苯醚

(Pb)

(Hg)

(Cd)

(Cr (VI))

(PBB)

(PBDE)

半导体芯片

焊接点

50