LTM4649 datasheet(21/28 Pages) LINER

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LTM4648

4648f

For more information www.linear.com/LTM4648

Figure 16. Thermal Image 5VIN to 1.5VOUT at 10A

(No Heat Sink, No Air Flow and Room Temperature)

applicaTions inForMaTion

Figure 17. Recommended PCB Layout

• Place high frequency ceramic input and output capaci-

tors next to the VIN, GND and VOUT pins to minimize

high frequency noise.

• Place a dedicated power ground layer underneath the

unit.

• To minimize the via conduction loss and reduce module

thermal stress, use multiple vias for interconnection

between top layer and other power layers.

• Do not put vias directly on the pads, unless they are

capped.

• Use a separated SGND ground copper area for com-

ponents connected to signal pins. Connect the SGND

to GND underneath the unit.

Figure17givesagoodexampleoftherecommendedlayout.

VOUT

GND

COUT

CIN

VIN

4648 F17

GND

Characteristicssectionandadjustedwiththeaboveambient

temperaturemultiplicativefactors.Theprintedcircuitboard

is a 1.6mm thick four layer board with two ounce copper

for the two outer layers and one ounce copper for the two

inner layers. The PCB dimensions are 95mm × 76mm.

Safety Considerations

The LTM4648 module does not provide isolation from VIN

to VOUT. There is no internal fuse. If required, a slow blow

fuse with a rating twice the maximum input current needs

tobeprovidedtoprotecteachunitfromcatastrophicfailure.

Layout Checklist/Example

The high integration of LTM4648 makes the PCB board

layout very simple and easy. However, to optimize its

electrical and thermal performance, some layout con-

siderations are still necessary.

• Use large PCB copper areas for high current path,

including VIN, GND and VOUT. It helps to minimize the

PCB conduction loss and thermal stress.

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