LP28400A – 02

Sep.-2016

www.lowpowersemi.com

Page 4 of 10

Preliminary Datasheet

LP28400A

Absolute Maximum Ratings

Note 1



VIN,LX, RS,VBAT,PB to GND ------------------------------------------------------------------------------------------------------0.3V to 18V



VL to GND ------------------------------------------------------------------------------------------------------------------------------- -0.3V to 6V



REG,STAT to GND ----------------------------------------------------------------------------------------------------------- -0.3V to VL+0.3V



Maximum Junction Temperature ---------------------------------------------------------------------------------------------------------- 150°C



Operating Junction Temperature Range (TJ) --------------------------------------------------------------------------------- -40℃ to 85°C



Maximum Soldering Temperature (at leads, 10 sec) --------------------------------------------------------------------------------- 260°C

Note 1.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress

ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections

of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Thermal Information



Maximum Power Dissipation (ESOP8, PD,TA=25°C) ------------------------------------------------------------------------------- 2.0W



Thermal Resistance (ESOP8,JA) -------------------------------------------------------------------------------------------------------- 46℃/W

ESD Susceptibility





Note 2.

The Human body model (HBM) is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. The testing is done according

JEDEC.

Note 3.

Machine Model (MM) is a 200pF capacitor discharged through a 500nH inductor with no series resistor into each pin. The testing is

done according JEDEC.