Preliminary Datasheet

LP6282

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Page 5 of 9

LP6282–00 Version 0.1 SET.-2017

Absolute Maximum Ratings

Note 1



VIN, EN, BSW to GND

------------------------------------------------------------------------

−0.3V to +6V



FB, FBP, FBN, DLY, REF to GND

-----------------------------------------------------------

−0.3V to +6V



AVDD, LX to GND

------------------------------------------------------------------------------

−0.3V to +15V



OPI, OPO, DRVP, DRVN to GND

----------------------------------------------------------

−0.3V to (AVDD + 0.3V)



CTRL, VS to GND

------------------------------------------------------------------------------

−0.3V to +15V



------------------------------------------

−40°C to +150°C



Operation Ambient Temperature Range

--------------------------------------------------

−40°C to +85°C



Storage Temperature Range

----------------------------------------------------------------

−65°C to +150°C



Maximum Soldering Temperature (at leads, 10sec)

----------------------------------- +260°C



Maximum Junction Temperature

----------------------------------------------------------- +150°C

Note 1. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress

ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of

the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Thermal Information



Thermal Resistance

, θ

JA

, θ

JC