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GFDASPA2.24 Folha de dados(PDF) 12 Page - OSRAM GmbH |
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GFDASPA2.24 Folha de dados(HTML) 12 Page - OSRAM GmbH |
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12 / 21 page ![]() 2017-12-12 12 Version 1.1 GF DASPA2.24 Note: Package not suitable for ultra sonic cleaning. For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Anm.: Das Gehäuse ist für Ultraschallreinigung nicht geeignet. Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter Standard- Stickstoffatmosphäre zu löten. Recommended Solder Pad 8) page 20 Reflow soldering Empfohlenes Lötpaddesign 8) Seite 20 Reflow-Löten |
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