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PC755 Folha de dados(PDF) 7 Page - ATMEL Corporation |
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PC755 Folha de dados(HTML) 7 Page - ATMEL Corporation |
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7 / 50 page ![]() 7 PC755/745 2138D–HIREL–06/03 Figure 3 (in part A) shows the pinout of the PC755, 360 PBGA packages as viewed from the top surface. Part B shows the side profile of the PBGA package to indicate the direc- tion of the top surface view. Figure 3. Pinout of the PC755, 360 PBGA, CBGA and CI-CGA Packages as Viewed from the Top Surface A B C D E F G H J K L M N P R T 12 3 4 5 6 78 9 10 11 12 13 14 15 16 Not to Scale 17 18 19 U V W View Die Substrate Assembly Encapsulant Part B Part A |
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