TLV2780CDBVT datasheet(16/32 Pages) TI

Nome de Peças	TLV2780CDBVT

Descrição Electrónicos	FAMILY OF 1.8V HIGH SPEED RAIL TO RAIL INPUT OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN

PDF	32 Pages

Scroll/Zoom	100%

Fabricante Electrônico	TI [Texas Instruments]

Página de início	http://www.ti.com

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16 / 32 page

TLV2780, TLV2781, TLV2782, TLV2783, TLV2784, TLV2785, TLV278xA

FAMILY OF 1.8 V HIGHSPEED RAILTORAIL INPUT/OUTPUT

OPERATIONAL AMPLIFIERS WITH SHUTDOWN

SLOS245E − MARCH 2000 − REVISED JANUARY 2005

WWW.TI.COM

APPLICATION INFORMATION

general power dissipation considerations

For a given

θJA, the maximum power dissipation is shown in Figure 34 and is calculated by the following formula:

D +

MAX

–T

Where:

= Maximum power dissipation of TLV278x IC (watts)

TMAX = Absolute maximum junction temperature (150°C)

= Free-ambient air temperature (

°C)

θJA = θJC + θCA

θJC = Thermal coefficient from junction to case

θCA = Thermal coefficient from case to ambient air (°C/W)

0.75

0.5

−55 −40 −25 −10 5

1.25

1.5

MAXIMUM POWER DISSIPATION

FREE-AIR TEMPERATURE

1.75

20 35 50

0.25

TA − Free-Air Temperature − °C

65 80 95 110 125

MSOP Package

Low-K Test PCB

θJA = 260°C/W

TJ = 150°C

PDIP Package

Low-K Test PCB

θJA = 104°C/W

SOIC Package

Low-K Test PCB

θJA = 176°C/W

SOT-23 Package

Low-K Test PCB

θJA = 324°C/W

NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.

Figure 34. Maximum Power Dissipation vs Free-Air Temperature

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