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AD667 Folha de dados(PDF) 1 Page - Analog Devices |
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AD667 Folha de dados(HTML) 1 Page - Analog Devices |
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1 / 6 page ![]() This specification documents the detail requirements for space qualified product manufactured on Analog Devices, Inc.’s QML certified line per MIL-PRF-38535 Level V except as modified herein. The manufacturing flow described in the STANDARD SPACE LEVEL PRODUCTS PROGRAM brochure is to be considered a part of this specification. http://www.analog.com/aerospace. This data sheet specifically details the space grade version of this product. A more detailed operational description and a complete data sheet for commercial product grades can be found at www.analog.com/AD667. : Part Number Description AD667-703F Microprocessor-Compatible 12-Bit D/A Converter AD667-703D Microprocessor-Compatible 12-Bit D/A Converter AD667-713F Radiation Tested, Microprocessor-Compatible 12-Bit D/A Converter . Letter Descriptive designator 1 Case Outline (Lead Finish per MIL-PRF-38535) D CDIP2-T28 28-Lead ceramic dual-in-line package (SIDEBRAZED) F CDFP3-F28 28-Lead bottom-brazed flatpack ¹ See MIL-STD-1835 VCC to power ground .............................................................................................. 0 to +18V VEE to power ground ............................................................................................... 0 to -18V Digital inputs (pins 11-15, 17-28) to power ground ....................................... -1.0V to +7.0V Reference in to Reference ground ............................................................................... ±12V Bipolar offset to reference ground ................................................................................ ±12V 10V span R to reference ground ................................................................................. ±12V 20V span R to reference ground ................................................................................. ±24V REF OUT, VOUT (Pins 6, 9) ................................................... Indefinite short to power ground ........... .......................................................................................... Momentary short to VCC Power dissipation.................................................................................................... 1000mW Storage temperature range ...........................................................................-65° to +150°C Lead temperature range (Soldering, 10sec)............................................................ +300°C Operating Temperature Range................................................................... -55°C to +125°C Junction Temperature (TJ)....................................................................................... +150°C : Thermal Resistance, Sidebrazed (D) Package Junction-to-Case ( JC) = 25°C/W Max 22 for F Junction-to-Ambient ( JA) = 60°C/W Max 60 for F |
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