11

LTC1669

1669f

MS8 Package

8-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1660)

MSOP (MS8) 0603

0.53

± 0.152

(.021

± .006)

SEATING

PLANE

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.18

(.007)

0.254

(.010)

1.10

(.043)

MAX

0.22 – 0.38

(.009 – .015)

TYP

0.127

± 0.076

(.005

± .003)

0.86

(.034)

REF

0.65

(.0256)

BSC

0

° – 6° TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

12

3

4

4.90

± 0.152

(.193

± .006)

8

7 6 5

3.00

± 0.102

(.118

± .004)

(NOTE 3)

3.00

± 0.102

(.118

± .004)

(NOTE 4)

0.52

(.0205)

REF

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

0.889

± 0.127

(.035

± .005)

RECOMMENDED SOLDER PAD LAYOUT

0.42

± 0.038

(.0165

± .0015)

TYP

0.65

(.0256)

BSC

1.50 – 1.75

(NOTE 4)

2.80 BSC

0.30 – 0.45 TYP

5 PLCS (NOTE 3)

DATUM ‘A’

0.09 – 0.20

(NOTE 3)

S5 TSOT-23 0302

PIN ONE

2.90 BSC

(NOTE 4)

0.95 BSC

1.90 BSC

0.80 – 0.90

1.00 MAX

0.01 – 0.10

0.20 BSC

0.30 – 0.50 REF

NOTE:

1. DIMENSIONS ARE IN MILLIMETERS

2. DRAWING NOT TO SCALE

3. DIMENSIONS ARE INCLUSIVE OF PLATING

4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR

5. MOLD FLASH SHALL NOT EXCEED 0.254mm

6. JEDEC PACKAGE REFERENCE IS MO-193

3.85 MAX

0.62

MAX

0.95

REF

RECOMMENDED SOLDER PAD LAYOUT

PER IPC CALCULATOR

1.4 MIN

2.62 REF

1.22 REF

S5 Package

5-Lead Plastic TSOT-23

(Reference LTC DWG # 05-08-1635)

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.