| Fabricante Electrônico | Nome de Peças | Folha de dados | Descrição Electrónicos |
 Japan Aviation Electron... |
FO-FC-RS-A2-R
|
110Kb / 1P |
THE SHAPE OF INDICATED RADIUS PART IS NOT STRICT REQUIREMENT
|
 Honeywell Solid State E... |
SS94A1
|
64Kb / 1P |
CENTERLINE OF HALL CELL ONLY THELOCATION OF CERAMIC COVER IS SPECIFIED
|
|
SS94A2D
|
66Kb / 1P |
CENTERLINE OF HALL CELL ONLY
|
 Tiger Electronic Co.,Lt... |
LT10.7MS2
|
460Kb / 8P |
This specification shall cover the characteristics of the ceramic
|
 STMicroelectronics |
UM1755
|
1Mb / 123P |
The purpose of this document is to describe the design of the application
17-Nov-2014 |
|
UM1865
|
1Mb / 132P |
The purpose of this document is to describe the design of the application
04-Mar-2015 |
 Wurth Elektronik GmbH &... |
784787101
|
589Kb / 7P |
It is recommeded that the temperature of the component does not exceed
|
|
784787120
|
589Kb / 7P |
It is recommeded that the temperature of the component does not exceed
|
|
784787121
|
589Kb / 7P |
It is recommeded that the temperature of the component does not exceed
|
 NXP Semiconductors |
MC56F826XXDS
|
1Mb / 60P |
The following table is the comparsion of features among members of the family.
Rev. 0, 08/2018 |