0015477766 pdf, 0015477766 Descrição Electrónicos, 0015477766 Folha de dados, 0015477766 view ::: ALLDATASHEET :::

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0015477766 Folha de dados (PDF) - Molex Electronics Ltd.

Nome de Peças	0015477766

Descrição Electrónicos	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 66 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

Tamanho do Arquivo	388.6 Kbytes

Html View	1 2 3 4

Fabricante Electrônico	MOLEX2 [Molex Electronics Ltd.]

Página de início	http://www.molex.com

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0015477766 Folha de dados (PDF) - Molex Electronics Ltd.

Nº de peça semelhante - 0015477766

Fabricante Electrônico	Nome de Peças	Folha de dados	Descrição Electrónicos
Molex Electronics Ltd.	0015477766	29Kb / 2P	2.54mm Pitch C-Grid Header, Through Hole, Dual Row, Vertical, High Temperature

Descrição semelhante - 0015477766

Fabricante Electrônico	Nome de Peças	Folha de dados	Descrição Electrónicos
Molex Electronics Ltd.	0015477740	388Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 40 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
	0015477710	388Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 10 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
	0015477716	388Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
	0015477762	388Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 62 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
	0015477750	388Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 50 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
	0015477726	388Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 26 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
	0015477764	388Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 64 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
	0015800225	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
	15-80-0305	40Kb / 2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
	15-80-0665	40Kb / 2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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