2904492 pdf, 2904492 Descrição Electrónicos, 2904492 Folha de dados, 2904492 view ::: ALLDATASHEET :::

Nome de Peças	2904492

Descrição Electrónicos	Bridging of 2 to 10 devices with maximum module spacing of 22.5 mm

Tamanho do Arquivo	56.91 Kbytes

Html View	1 2

Fabricante Electrônico	PHOENIX [PHOENIX CONTACT]

Página de início	http://www.phoenixcontact.com

Logo

Nº de peça semelhante - 2904492

Fabricante Electrônico	Nome de Peças	Folha de dados	Descrição Electrónicos
PHOENIX CONTACT	2904490	57Kb / 2P	Bridging of 2 to 10 devices with maximum module spacing of 22.5 mm
	2904491	57Kb / 2P	Bridging of 2 to 10 devices with maximum module spacing of 22.5 mm
	2904493	57Kb / 2P	Bridging of 2 to 10 devices with maximum module spacing of 22.5 mm
	2904494	57Kb / 2P	Jumper - BRIDGE-PT 6
	2904495	56Kb / 2P	Jumper - BRIDGE-PT 7

Fabricante Electrônico	Nome de Peças	Folha de dados	Descrição Electrónicos
ATMEL Corporation	AT88SC0104CA-SH-T	289Kb / 23P	One of a family of devices with user memories from 1Kbit to 8Kbits
PHOENIX CONTACT	2904490	57Kb / 2P	Bridging of 2 to 10 devices with maximum module spacing of 22.5 mm
	2904491	57Kb / 2P	Bridging of 2 to 10 devices with maximum module spacing of 22.5 mm
	2904493	57Kb / 2P	Bridging of 2 to 10 devices with maximum module spacing of 22.5 mm
Hirose Electric	FI	1Mb / 7P	1.27 mm contact pitch contributes to downsizing of electrical devices.
PHOENIX CONTACT	2764399	81Kb / 4P	Optimum accommodation of electronic components with graded pitches with a design width of 22.5 mm, 45 mm, 67.5 mm, and 90 mm
	2764881	148Kb / 9P	Optimum accommodation of electronic components with graded pitches with a design width of 22.5 mm, 45 mm, 67.5 mm, and 90 mm
	2764946	148Kb / 9P	Optimum accommodation of electronic components with graded pitches with a design width of 22.5 mm, 45 mm, 67.5 mm, and 90 mm
	2907376	149Kb / 9P	Optimum accommodation of electronic components with graded pitches with a design width of 22.5 mm, 45 mm, 67.5 mm, and 90 mm
	2969401	61Kb / 2P	DIN rail bus connector for potential bridging of devices arranged next to one another across all modules.