Description
The EMIF06-HSD03F3 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering. The EMIF06-HSD03F3 Flip-Chip packaging means the package size is equal to the die size. That’s why EMIF06-HSD03F3 is a very small device. Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 18 kV. Flip- hip package C ( bumps) 17 , 2 9FF ,2N6034 22N6034 , 2 '(7 , 2 *1' *1' *1' , 2 , 2 Ix Ox R = 1 Ω L 1 nH = CLINE = 2.5 pF DET VCC