DESCRIPTION
The UM7500 series features Microsemi’s innovative passivated chip design which takes advantage of the latest silicon wafer bonding and junction passivation techniques. This new series of PIN diodes incorporates all of the desirable RF properties of previous Microsemi diodes plus extremely low leakages and very stable reverse characteristics. Power dissipation capability is assured by Microsemi’s metallurgically bonded, fused in glass construction. This technique continues to be the optimum approach for applications requiring reliable, high power diodes.

KEY FEATURES
◾ Voltage Ratings to 1400 Volt
◾ Fully Passivated PIN Chip
◾ Low Leakage, IR < 0.5 µA
◾ Void Less, Particle Free Construction
◾ Hermetic Fused in Glass
◾ Low Loss, Low Distortion
◾ Surface Mount Package Available
◾ Metallurgically Bonded, Thermally Matched Construction
◾ Compatible with automatic insertion equipment

APPLICATIONS/BENEFITS
◾ Isolated stud package available
◾ Surface mount package available
◾ RoHS compliant packaging available: use UMX7501B, etc.