| Fabricante Electrônico | Nome de Peças | Folha de dados | Descrição Electrónicos |
 Panasonic Semiconductor |
AQY211EHAX
|
945Kb / 4P |
High cost-performance DIP4-pin type with reinforced insulation
|
|
AQY211EH
|
956Kb / 5P |
High cost-performance DIP4-pin type with reinforced insulation
|
 List of Unclassifed Man... |
HF-225U
|
565Kb / 2P |
Non-Reinforced Phase Change Thermal Interface Material
|
|
HF-225UT
|
321Kb / 2P |
Un-Reinforced, Pressure Sensitive Phase Change Thermal Interface Material
|
|
HF-300G
|
569Kb / 2P |
Fiberglass-Reinforced, Phase Change Thermal Interface Material
|
|
HF-625
|
314Kb / 2P |
Reinforced Phase Change Thermal Interface Material
|
|
TIC-650P
|
282Kb / 2P |
Electrically Insulating, High Performance,Thermally Conductive Phase Change Material
|
 Texas Instruments |
ISO7830
|
1Mb / 37P |
High-Performance, 8000-VPK Reinforced Triple Digital Isolators
|
|
ISO7831
|
1Mb / 37P |
High-Performance, 8000-VPK Reinforced Triple Digital Isolators
|
 Laird Tech Smart Techno... |
TPCM7000
|
215Kb / 1P |
High Performance TIM
10122021 |