| Fabricante Electrônico | Nome de Peças | Folha de dados | Descrição Electrónicos |
 Molex Electronics Ltd. |
0879144405
|
4Mb / 57P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 44 Circuits, 0.76關m (30關) Gold (Au) Plating, Tray Packaging, Lead-free
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0879143435
|
3Mb / 48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
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0879143205
|
4Mb / 57P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 0.76關m (30關) Gold (Au) Plating, Tray Packaging, Lead-free
|
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0879144204
|
4Mb / 57P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 42 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
|
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0879144201
|
770Kb / 11P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 42 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
|
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0879142815
|
3Mb / 48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75關m (30關) Gold (Au) Plating, Tray Packaging, Lead-free
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0879141001
|
770Kb / 11P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 10 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
|
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0879140616
|
3Mb / 48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 6 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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0879140001
|
3Mb / 48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 10 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
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0879140806
|
770Kb / 11P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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