DESCRIPTION
Low solid no-clean flux classified as 2.2.3.A according to EN 29454-1 (DIN 8511, F-SW34) for soldering electric and
electronic equipment.
Halogen-free activated Stannol 500-3445 guarantees excellent wetting of different metallic finishes on PCBs (e.g. OSP,
Ni/Au, i.Tin, HAL). This makes it easy to introduce to new pcb types with an alternative surface finish. Wetting problems will
not occur. In order to meet all requirements for electrical safety and corrosion resistance on No-Clean soldered boards, a
very low resin content (<0,2%) is included in the formulation.
APPLICATION
With respect to the flux application Stannol 500-3445 has optimum properties that make it usable in foam as well as in spray
fluxer. Preheat setting should be adjusted to such level that the topside temperature reaches 110°C before entering the
wave. This ensures that solvent is evaporated completely and the flux will be sufficiently activated and ready for soldering.
Evaporation of solvent can change the composition. Evaporation causes an increase of the solid content and therefore the
density increases. This can be checked with the Stannol Mini-Titration-Kit.