Features
■For surface mounted applications in order to optimize board space
■Low profile package
■Built in strain relief
■Gla ss p assivated j unction
■Low inductance
■Excellent clamping capability
■600W peak pulse power capability at 10/1000 μ s waveform, r epetition r ate (duty cycle): 0.01%
■Fast response time
■Typical IR less than 1 μ A above 12V
■High Temperature soldering: 26 0 ℃℃/10 seconds at terminals
■Plastic package has underwriters laboratory flammability 94V 0
■Meets MSL level 1, per J STD 020
■IEC61000 4 2 ESD 30KV Air, 30KV contact compliance

Applications
■I/O interface ■ AC/DC power supply
■Low frequency signal transmission line (RS232, RS485, etc.)