Features
■ For surface mounted applications in order to optimize board space
■ Low profile package
■ Glass passivated junction
■ Low inductance
■ Excellent clamping capability
■ 400W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycle): 0.01%
■ Fast response time
■ Typical IR less than 1μA above 10V
■ High Temperature soldering: 260℃/10 seconds at terminals
■ Plastic package has underwriters laboratory flammability 94V-0
■ Meets MSL level 1, per J-STD-020
■
IEC61000-4-2 ESD 30KV Air, 30KV contact compliance