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TLV2231CDBV Folha de dados (PDF) - Texas Instruments

TLV2231CDBV Datasheet PDF - Texas Instruments
Nome de Peças TLV2231CDBV
Download  TLV2231CDBV Download
Tamanho do Arquivo   684.98 Kbytes
página   30 Pages
Fabricante Electrônico  TI2 [Texas Instruments]
Página de início  https://www.ti.com
Logo TI2 - Texas Instruments
Descrição Electrónicos Advanced LinCMOS RAIL-TO-RAIL LOW-POWER SINGLE OPERATIONAL AMPLIFIERS

TLV2231CDBV Datasheet (PDF)

Go To PDF Page Download Folha de dados
TLV2231CDBV Datasheet PDF - Texas Instruments

Nome de Peças TLV2231CDBV
Download  TLV2231CDBV Click to download

Tamanho do Arquivo   684.98 Kbytes
página   30 Pages
Fabricante Electrônico  TI2 [Texas Instruments]
Página de início  https://www.ti.com
Logo TI2 - Texas Instruments
Descrição Electrónicos Advanced LinCMOS RAIL-TO-RAIL LOW-POWER SINGLE OPERATIONAL AMPLIFIERS

TLV2231CDBV Folha de dados (HTML) - Texas Instruments


TLV2231CDBV Detalhes do produto

Output Swing Includes Both Supply Rails
Low Noise . . . 15 nV/√Hz Typ at f = 1 kHz
Low Input Bias Current . . . 1 pA Typ
Fully Specified for Single-Supply 3-V and
5-V Operation
Common-Mode Input Voltage Range
Includes Negative Rail
High Gain Bandwidth . . . 2 MHz at
VDD = 5 V With 600-Ω Load
High Slew Rate . . . 1.6 V/μs at VDD = 5 V
Wide Supply Voltage Range
2.7 V to 10 V
Macromodel Included

description
The TLV2231 is a single low-voltage operational amplifier available in the SOT-23 package. It offers 2 MHz of
bandwidth and 1.6 V/μs of slew rate for applications requiring good ac performance. The device exhibits
rail-to-rail output performance for increased dynamic range in single or split supply applications. The TLV2231
is fully characterized at 3 V and 5 V and is optimized for low-voltage applications.
The TLV2231, exhibiting high input impedance and low noise, is excellent for small-signal conditioning of
high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels
combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing
applications. In addition, the rail-to-rail output feature with single- or split-supplies makes this family a great
choice when interfacing with analog-to-digital converters (ADCs). The device can also drive 600-Ω loads for
telecom applications.
With a total area of 5.6mm2, the SOT-23 package only requires one-third the board space of the standard 8-pin
SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal
source, minimizing noise pick-up from long PCB traces. TI has also taken special care to provide a pinout that
is optimized for board layout (see Figure 1). Both inputs are separated by GND to prevent coupling or leakage
paths. The OUT and IN– terminals are on the same end of the board for providing negative feedback. Finally,
gain setting resistors and the decoupling capacitor are easily placed around the package.




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