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SN74LVC2G132 Folha de dados (PDF) - Texas Instruments

SN74LVC2G132 Datasheet PDF - Texas Instruments
Nome de Peças SN74LVC2G132
Download  SN74LVC2G132 Download
Tamanho do Arquivo   750.39 Kbytes
página   22 Pages
Fabricante Electrônico  TI2 [Texas Instruments]
Página de início  https://www.ti.com
Logo TI2 - Texas Instruments
Descrição Electrónicos Dual 2-Input NAND Gate With Schmitt-Trigger Inputs

SN74LVC2G132 Datasheet (PDF)

Go To PDF Page Download Folha de dados
SN74LVC2G132 Datasheet PDF - Texas Instruments

Nome de Peças SN74LVC2G132
Download  SN74LVC2G132 Click to download

Tamanho do Arquivo   750.39 Kbytes
página   22 Pages
Fabricante Electrônico  TI2 [Texas Instruments]
Página de início  https://www.ti.com
Logo TI2 - Texas Instruments
Descrição Electrónicos Dual 2-Input NAND Gate With Schmitt-Trigger Inputs

SN74LVC2G132 Folha de dados (HTML) - Texas Instruments


SN74LVC2G132 Detalhes do produto

1FEATURES
2• Available in Texas Instruments NanoFree™
Package
• Supports 5-V VCC Operation
• Inputs Accept Voltages to 5.5 V
• Max tpd of 5.3 ns at 3.3 V
• Low Power Consumption, 10-μA Max ICC
• ±24-mA Output Drive at 3.3 V
• Typical VOLP (Output Ground Bounce) <0.8 V at
VCC = 3.3 V, TA = 25°C
• Typical V OHV (Output VOH Undershoot) >2 V at
VCC = 3.3 V, TA = 25°C
• I off Supports Live Insertion, Partial Power
Down Mode, and Back Drive Protection
• Support Translation Down (5V to 3.3V and 3.3V
to 1.8V)
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)

DESCRIPTION
This dual 2-input NAND gate with Schmitt-trigger
inputs is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC2G132 contains two inverters and
performs the Boolean function Y = A ⋅ B or Y = A + B in positive logic. The device functions as two
independent inverters, but because of Schmitt action,
it has different input threshold levels for positive-going
(VT+) and negative-going (VT-) signals.
NanoFree™ package technology is a major
breakthrough in IC packaging concepts, using the die
as the package.
This device can be triggered from the slowest of input
ramps and still give clean jitter-free output signals.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow
through the device when it is powered down.




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