FEATURES

• Very low profile - typical height of 1.0 mm

• Ideal for automated placement

• Glass passivated chip junction

• Ultrafast recovery times for high frequency

• Low forward voltage drop, low power loss

• Low thermal resistance

• Meets MSL level 1 per J-STD-020C, LF max peak of 260 °C

• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

TYPICAL APPLICATIONS

  For use in secondary rectification and freewheeling for ultrafast switching speeds of ac-to-ac and dc-to-dc converters in high temperature conditions for both consumer and automotive applications.