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SOIC Folha de dados (PDF) - Amkor Technology

SOIC Datasheet PDF - Amkor Technology
Nome de Peças SOIC
Download  SOIC Download
Tamanho do Arquivo   780.44 Kbytes
página   3 Pages
Fabricante Electrônico  AMKOR [Amkor Technology]
Página de início  http://www.amkor.com
Logo AMKOR - Amkor Technology
Descrição Electrónicos ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based

SOIC Datasheet (PDF)

Go To PDF Page Download Folha de dados
SOIC Datasheet PDF - Amkor Technology

Nome de Peças SOIC
Download  SOIC Click to download

Tamanho do Arquivo   780.44 Kbytes
página   3 Pages
Fabricante Electrônico  AMKOR [Amkor Technology]
Página de início  http://www.amkor.com
Logo AMKOR - Amkor Technology
Descrição Electrónicos ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based

SOIC Folha de dados (HTML) - Amkor Technology


SOIC Detalhes do produto

FEATURES
Cu wire interconnect for low cost
Standard JEDEC package outlines
Multi-die production capability
Turnkey test services, including strip test options
ExposedPad configuration for increased thermal efficiency
Up to 60% improvement in Theta JA (compared to standard TSSOP or SOIC)
Green materials are standard – Pb-free and RoHS compliant
Stealth dicing (narrow saw streets)
Larger/Higher density leadframe strips
Leadframe roughening for improved MSL capability




Nº de peça semelhante - SOIC

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Sobre a Amkor Technology


Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Esta informação é apenas para fins informativos gerais, não seremos responsáveis por qualquer perda ou dano causado pelas informações acima.




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