1. General description
NPN medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D)
leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and
visible and solderable side pads.

2. Features and benefits
• High collector current capability IC and ICM
• Reduced Printed-Circuit Board (PCB) area requirements
• Exposed heat sink for excellent thermal and electrical conductivity
• Two current gain selections
• Leadless very small SMD plastic package with medium power capability
• Suitable for Automatic Optical Inspection (AOI) of solder joint

3. Applications
• Linear voltage regulators
• Battery driven devices
• MOSFET drivers
• High-side switches
• Power management
• Amplifiers