| Fabricante Electrônico | Nome de Peças | Folha de dados | Descrição Electrónicos |
 STMicroelectronics |
SSOP24
|
59Kb / 4P |
24-LEAD SHRINK SMALL OUTLINE PACKAGE
Nov-2002 |
 National Semiconductor ... |
MTD48
|
62Kb / 1P |
48 Lead Molded Thin Shrink Small Outline Package, JEDEC
|
 NXP Semiconductors |
SOT340-1
|
11Kb / 1P |
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
2003 Mar 24 |
 National Semiconductor ... |
MTC16
|
70Kb / 1P |
16 Lead Molded Thin Shrink Small Outline Package, JEDEC NS Package Number MTC16
|
 STMicroelectronics |
TSSO20
|
57Kb / 4P |
20-LEAD THIN SHRINK SMALL OUTLINE
Nov-2002 |
 Intersil Corporation |
M24.173B
|
42Kb / 1P |
Thin Shrink Small Outline Wxposed Pad Plastic Packages ( EPTSSOP)
|
 NXP Semiconductors |
SOT765-1
|
13Kb / 1P |
plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
2002 Jun 07 |
 fujitsu semiconductor |
FPT-20P-M04
|
37Kb / 1P |
THIN SHRINK SMALL OUTLINE PACKAGE
|
 Amkor Technology |
CSSOP
|
304Kb / 1P |
Ceramic Shrink Small Outline Package
|
 STMicroelectronics |
TSSOP14
|
58Kb / 4P |
14-LEAD THIN SHRINK SMALL OUTLINE
Nov-2002 |