® Isolated Package
® High Voitage Isolation= 2.5KVRMS ®
® Sink to Lead Creepage Dist.= 4.8mm
® Dynamic dv/dt Rating
® Low Thermal Resistance

Description

Third Generation HEXFETs from International Rectifier provide the designer
with the best combination of fast switching, ruggedized device design, iow
on-resistance and cost-effectiveness.

The TO-220 Fullpak eliminates the need for additional insulating hardware in
commercial-industrial applications. The moulding compound used provides a
high isolation capability and a low thermal resistance between the tab and
external heatsink. This isolation is equivalent to using a 100 micron mica
barrier with standard TO-220 product. The Fullpak is mounted to a heatsink
using a single clip or by a single screw fixing.