Features
• Packaged in 20-pin QSOP/SSOP
• Split 1:10 fanout Buffer
• Maximum skew between outputs of different packages
0.75 ns
• Max propagation delay of 3.8 ns
• Operating voltage of 1.5 V to 2.5 V on Bank A
• Operating voltage of 1.5 V to 2.5 V on Banks B and C
• Advanced, low power, CMOS process
• Industrial temperature range -40° C to +85° C
• 3.3 V tolerant input when VDDA=2.5 V
• Pb (lead) free packaging