Key Features
■ Compatible with Bluetooth® 5.2, ETSI EN
300 328 and EN 300 440 Class 2 (Europe),
FCC CFR47 Part 15 (US) and ARIB STDT66
(Japan)
■ Flexible processing power
□ 32 kHz up to 160 MHz 32-bit Arm
Cortex-M33 with 8 kB, four-way
associative cache, FPU and eightsegments
MPU
□ A flexible and configurable Bluetooth®
Low Energy MAC engine implementing
the controller stack up to HCI
□ An Arm Cortex M0+ based sensor node
controller for sensors manipulation
□ A 2D GPU for advanced graphics
processing
□ Optimized power modes (Extended
sleep, Deep sleep, and Hibernation)
■ Memories
□ 1.5 MB Data SRAM with retention
□ 4 kB One-Time-Programmable (OTP)
memory for secure key storage
□ 8 kB ICache SRAM with retention
□ 8 kB DCache 10-Nov-2022SRAM with retention
□ 32 kB ROM (boot, PKI routines)
■ Power management
□ Low Iq SIMO Buck DC-DC converter
□ Boost DC-DC converter (4.5 V – 5.0 V)
□ Four power supply pins for external
devices DCDC supported
□ Hardware charger (up to 5.0 V) with
programmable curves and JEITA
support
□ Integrated Power Path Management