Features
• Specifications per DSCC VID V62/10601-01XB
• Full military temperature electrical performance from
-55°C to +125°C
• Controlled baseline with one wafer fabrication site and one
assembly/test site
• Full homogeneous lot processing in wafer fab
• No combination of wafer fabrication lots in assembly
• Full traceability through assembly and test by date/trace
code assignment
• Enhanced process change notification
• Enhanced obsolescence management
• Eliminates need for up-screening a COTS component
• ±16.5kV IEC61000 ESD protection on RS-485 inputs
• Class 3 ESD level on all other pins. . . . . . . . . . . . . .>5kV HBM
• Wide supply range . . . . . . . . . . . . . . . . . . . . . . . . . 3.0V to 5.5V
• Specified for +125°C operation
• Logic supply pin (VL) eases operation in mixed supply
systems
• Full fail-safe (open, short, terminated/undriven)
• True 1/8 unit load allows up to 256 devices on the bus
• High data rates. . . . . . . . . . . . . . . . . . . . . . . . . . up to 16Mbps
• Low quiescent supply current. . . . . . . . . . 500µA (maximum)
• Very low shutdown supply current . . . . . . . 20µA (maximum)
• -7V to +12V common-mode input voltage range
• Tri-statable Rx available (active low or high EN input)
• 5V tolerant logic inputs when VCC  5V