FEATURES
 Access Times of 15, 17, 20, 25, 35, 45, 55ns
 MIL-STD-883 Compliant Devices Available
 Packaging
• 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP
(Package 400)
• 68 lead, 40mm CQFP (G4T)1, 3.56mm (0.140") (Package
502)
• 68 lead, 22.4mm CQFP (G2U), 3.56mm (0.140"),
(Package 510)
• 68 lead, 22.4mm (0.880") square, CQFP (G2L), 5.08mm
(0.200") high, (Package 528)
 Organized as 128Kx32; User Confi gurable as 256Kx16 or
512Kx8
 Commercial, Industrial and Military Temperature Ranges
 5 Volt Power Supply
 Low Power CMOS
 TTL Compatible Inputs and Outputs
 Built in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
 Weight:
WS128K32-XG2UX - 8 grams typical
WS128K32-XG2LX - 8 grams typical
WS128K32-XH1X - 13 grams typical
WS128K32-XG4TX1 - 20 grams typical
 Devices are upgradeable to 512Kx32