FEATURES
• Wire bondable
• Small size: 0.020 inches square to 0.060 inches
square
• Substrate: silicon with gold backing
• Dielectric: silicon dioxide / silicon nitride
• Capacitance range: 0.5 pF to 1000 pF
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912

APPLICATIONS
The NC series of capacitor chips are designed for assembly
in hybrid circuits using conventional wire-bonding
techniques. They provide excellent stability and
performance, and their small size gives the hybrid designer
greater layout flexibility. They are available as MNOS or
MOS capacitors. The MOS version is to be preferred when
low dielectric absorption is required.