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IIS3DWB Folha de dados (PDF) - STMicroelectronics

IIS3DWB Datasheet PDF - STMicroelectronics
Nome de Peças IIS3DWB
Download  IIS3DWB Download
Tamanho do Arquivo   1816.04 Kbytes
página   11 Pages
Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics
Descrição Electrónicos SensorTile Wireless Industrial Node development kit and reference

IIS3DWB Datasheet (PDF)

Go To PDF Page Download Folha de dados
IIS3DWB Datasheet PDF - STMicroelectronics

Nome de Peças IIS3DWB
Download  IIS3DWB Click to download

Tamanho do Arquivo   1816.04 Kbytes
página   11 Pages
Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics
Descrição Electrónicos SensorTile Wireless Industrial Node development kit and reference

IIS3DWB Folha de dados (HTML) - STMicroelectronics


IIS3DWB Detalhes do produto

Description
The STWIN SensorTile wireless industrial node (STEVAL-STWINKT1) is a development kit and reference design that simplifies prototyping and testing of advanced industrial IoT applications such as condition monitoring and predictive maintenance. The kit features a core system board with a range of embedded industrial-grade sensors and an ultra-low-power microcontroller for vibration analysis of 9-DoF motion sensing data across a wide range of vibration frequencies, including very high frequency audio and ultrasound spectra, and high precision local temperature and environmental monitoring. Product summary STWIN SensorTile Wireless Industrial Node development kit STEVALSTWINKT1 Firmware for STEVAL-STWINKT1 evaluation kit STSWSTWINKT01 Ultra-low-power ARM Cortex-M4 MCU with FPU STM32L4R9ZIJ6 3D Accelerometer + 3D Gyro iNEMO Inertial measurement unit (IMU) with machine learning core ISM330DHCX Ultra-wide bandwidth (up to 6 kHz), low-noise, 3axis digital vibration sensor IIS3DWB Firmware debug and update interface STLINK-V3MINI debugger

Features
■ Multi-sensing wireless platform implementing vibration monitoring and ultrasound detection
■ Built around STWIN core system board with processing, sensing, connectivity and expansion capabilities
■ Ultra-low-power ARM Cortex-M4 MCU at 120 MHz with FPU, 2048 kbytes Flash memory (STM32L4R9)
■ Micro SD Card slot for standalone data logging applications
■ Wireless BLE4.2 (on-board) and Wi-Fi (with STEVAL-STWINWFV1 expansion board), and wired RS485 and USB OTG connectivity
■ Option to implement Authentication and Brand protection secure solution with STSAFE-A110 (footprint)
■ Wide range of industrial IoT sensors: – ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor (IIS3DWB) – 3D accelerometer + 3D Gyro iNEMO inertial measurement unit (ISM330DHCX) with machine learning core – ultra-low-power high performance MEMS motion sensor (IIS2DH) – ultra-low-power 3-axis magnetometer (IIS2MDC) – digital absolute pressure sensor (LPS22HH) – relative humidity and temperature sensor (HTS221) – low-voltage digital local temperature sensor (STTS751) – industrial grade digital MEMS microphone (IMP34DT05) – wideband analog MEMS microphone (MP23ABS1)
■ Modular architecture, expandable via on-board connectors: – STMOD+ and 40-pin flex general purpose expansions – 12-pin male plug for connectivity expansions – 12-pin female plug for sensing expansions
■ Other kit components: – Li-Po battery 480 mAh – STLINK-V3MINI debugger with programming cable – Plastic box




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Sobre a STMicroelectronics


A STMicroelectronics é um fabricante multinacional de eletrônicos e semicondutores com sede em Genebra, Suíça.

A empresa oferece uma ampla gama de produtos, incluindo microcontroladores, sensores, amplificadores de energia e circuitos integrados para várias aplicações nos mercados automotivo, industrial e de consumo.

Fundada em 1987, a STMicroelectronics possui operações em mais de 100 países e é uma das maiores empresas de semicondutores do mundo.

*Esta informação é apenas para fins informativos gerais, não seremos responsáveis por qualquer perda ou dano causado pelas informações acima.




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