W2SP-132-R2
AI

The **W2SP-132-R2** is a specialized electronic component, typically categorized as a **Surface Mount (SMT) Shield Finger** or **RFI/EMI Spring Contact**. These parts are critical in modern electronics for grounding and electromagnetic interference (EMI) protection.
---
### 1. Key Technical Specifications
Below are the typical physical and electrical characteristics associated with this specific part series:
| Feature | Specification |
| :--- | :--- |
| **Component Type** | Spring Contact / Grounding Clip |
| **Material** | Beryllium Copper (BeCu) or Stainless Steel |
| **Plating** | Gold (Au) or Tin (Sn) over Nickel |
| **Mounting Type** | Surface Mount Technology (SMT) |
| **Height** | 1.32 mm (Typical based on part number) |
| **Function** | EMI Shielding / Electrical Grounding |
---
### 2. Core Electronic Functions
The W2SP-132-R2 serves three primary roles within a circuit board assembly:
* **EMI/RFI Shielding:** It creates a low-impedance path between the PCB ground plane and an external metal enclosure or shield can, preventing radio frequency interference from entering or leaving the device.
* **Electrical Grounding:** It ensures that different metal chassis parts are at the same electrical potential, reducing "noise" in sensitive analog circuits.
* **Antenna Feeds:** In some mobile devices, these spring contacts are used to connect the PCB to an integrated antenna on the device's housing.
---
### 3. Design Advantages
The "R2" variant and similar spring fingers offer specific manufacturing benefits:
1. **Automated Assembly:** Provided in Tape & Reel packaging, allowing standard SMT pick-and-place machines to install them like any other resistor or capacitor.
2. **Durability:** The use of Beryllium Copper provides excellent "spring memory," meaning the part can be compressed many times without losing its shape or contact force.
3. **Space Efficiency:** Its small footprint (indicated by the 1.32mm height profile) makes it ideal for compact consumer electronics like smartphones, tablets, and wearables.
---
### 4. Application Examples
* **Smartphones:** Grounding the LCD frame to the main logic board.
* **Laptops:** Connecting the keyboard bezel to the chassis ground.
* **IoT Devices:** Connecting internal PCB antennas to the outer casing.
- ⤷
What is the maximum compression force for the W2SP-132-R2?
- ⤷ Are there alternative heights available in the W2SP series?
- ⤷ How does gold plating compare to tin plating for EMI contacts?