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  • W2SP-132-R2

  • AI
    The **W2SP-132-R2** is a specialized electronic component, typically categorized as a **Surface Mount (SMT) Shield Finger** or **RFI/EMI Spring Contact**. These parts are critical in modern electronics for grounding and electromagnetic interference (EMI) protection. --- ### 1. Key Technical Specifications Below are the typical physical and electrical characteristics associated with this specific part series: | Feature | Specification | | :--- | :--- | | **Component Type** | Spring Contact / Grounding Clip | | **Material** | Beryllium Copper (BeCu) or Stainless Steel | | **Plating** | Gold (Au) or Tin (Sn) over Nickel | | **Mounting Type** | Surface Mount Technology (SMT) | | **Height** | 1.32 mm (Typical based on part number) | | **Function** | EMI Shielding / Electrical Grounding | --- ### 2. Core Electronic Functions The W2SP-132-R2 serves three primary roles within a circuit board assembly: * **EMI/RFI Shielding:** It creates a low-impedance path between the PCB ground plane and an external metal enclosure or shield can, preventing radio frequency interference from entering or leaving the device. * **Electrical Grounding:** It ensures that different metal chassis parts are at the same electrical potential, reducing "noise" in sensitive analog circuits. * **Antenna Feeds:** In some mobile devices, these spring contacts are used to connect the PCB to an integrated antenna on the device's housing. --- ### 3. Design Advantages The "R2" variant and similar spring fingers offer specific manufacturing benefits: 1. **Automated Assembly:** Provided in Tape & Reel packaging, allowing standard SMT pick-and-place machines to install them like any other resistor or capacitor. 2. **Durability:** The use of Beryllium Copper provides excellent "spring memory," meaning the part can be compressed many times without losing its shape or contact force. 3. **Space Efficiency:** Its small footprint (indicated by the 1.32mm height profile) makes it ideal for compact consumer electronics like smartphones, tablets, and wearables. --- ### 4. Application Examples * **Smartphones:** Grounding the LCD frame to the main logic board. * **Laptops:** Connecting the keyboard bezel to the chassis ground. * **IoT Devices:** Connecting internal PCB antennas to the outer casing.
    ✨ Follow-up Questions
    • ⤷ What is the maximum compression force for the W2SP-132-R2?
    • ⤷ Are there alternative heights available in the W2SP series?
    • ⤷ How does gold plating compare to tin plating for EMI contacts?