The **M2AS1-6424-R** is a specific electronic component typically categorized as a **DDR4 SO-DIMM memory module** designed for industrial or high-reliability applications. It is frequently manufactured by brands like **Apacer**. Below is a detailed breakdown of its electronic specifications and characteristics. --- ### ## 1. Technical Specifications The part number follows a standard nomenclature for memory modules. Here are the core electronic parameters: | Feature | Specification | | :--- | :--- | | **Type** | DDR4 SDRAM | | **Form Factor** | SO-DIMM (Small Outline Dual In-line Memory Module) | | **Capacity** | 8 GB (Typical for this series, though can vary by suffix) | | **Speed** | 2400 MT/s (PC4-2400) | | **Voltage** | 1.2V (Low Power) | | **Pin Count** | 260-Pin | | **Error Correction** | Non-ECC / Unbuffered | --- ### ## 2. Internal Electronic Architecture The module consists of several sub-components that manage data storage and retrieval: * **DRAM Chips:** Utilizes high-density CMOS bits. These are the physical integrated circuits (ICs) that store data. * **SPD (Serial Presence Detect) EEPROM:** A small 8-pin chip that stores information about the module's timing, voltage, and manufacturer. The BIOS reads this via the I2C/SMBus to configure the memory controller. * **Decoupling Capacitors:** Small surface-mount capacitors (MLCCs) placed near each DRAM chip to filter electrical noise and stabilize the 1.2V power rail. * **PCB Layers:** Usually a 6-layer or 8-layer PCB designed to minimize electromagnetic interference (EMI) and signal crosstalk. --- ### ## 3. Key Electronic Features * **1.2V Operation:** Compared to DDR3 (1.5V), this module reduces power consumption by approximately 20%, leading to lower heat generation. * **Gold Finger Plating:** The 260 pins are typically plated with 30u” gold to ensure reliable electrical contact and prevent oxidation in humid environments. * **Thermal Sensor (Optional/Variant Specific):** Some industrial versions include an integrated thermal sensor to monitor the chip temperature during high-load operations. --- ### ## 4. Application Context Because of the **"AS1"** designation in many Apacer parts, this specific model is often found in: 1. **Industrial PCs (IPC):** Ruggedized systems requiring stable memory. 2. **Embedded Systems:** Medical devices or automation controllers. 3. **Laptops/NUCs:** High-performance compact computing. ---