The **CW201212-R82J** is a high-frequency, wire-wound chip inductor commonly used in RF (Radio Frequency) communication circuits. This part is manufactured by companies like **Bourns** and follows specific naming conventions for its electrical properties. --- ### 1. Part Number Breakdown Understanding the nomenclature helps identify the physical and electrical characteristics of the component: | Segment | Meaning | Detail | | :--- | :--- | :--- | | **CW** | Series Type | Chip Wire-wound Inductor | | **2012** | Case Size (Metric) | 2.0mm x 1.2mm (Equivalent to **0805** Imperial) | | **12** | Height Code | Approximately 1.2mm height | | **R82** | Inductance Value | **0.82 µH** (820 nH) | | **J** | Tolerance | **±5%** | --- ### 2. Technical Specifications Below are the typical electrical parameters for this specific component: | Parameter | Value | | :--- | :--- | | **Inductance** | 820 nH @ 25.2 MHz | | **Tolerance** | ±5% | | **Q Factor (Min)** | 25 @ 25.2 MHz | | **SRF (Self-Resonant Frequency)** | 350 MHz (Minimum) | | **DCR (DC Resistance)** | 1.61 Ohms (Maximum) | | **I rms (Rated Current)** | 180 mA | | **Operating Temperature** | -40°C to +125°C | --- ### 3. Key Features and Construction * **Wire-wound Core:** Unlike multilayer inductors, the wire-wound construction allows for a much higher **Q (Quality) Factor**, meaning lower energy loss at high frequencies. * **Ceramic Core:** Usually built on a ceramic substrate, which provides excellent thermal stability and very high SRF. * **Miniature Footprint:** The 0805 (2012 metric) size is standard for compact PCB designs in mobile phones and GPS modules. --- ### 4. Common Applications Due to its high Q and precision, the CW201212-R82J is typically found in: 1. **RF Impedance Matching:** Used in antenna circuits to match the transceiver to the antenna. 2. **Filter Networks:** Employed in Low Pass Filters (LPF) or Band Pass Filters (BPF). 3. **Oscillators:** Stability in frequency-generating circuits. 4. **Wireless Communication:** Bluetooth, Wi-Fi, and cellular infrastructure. ---